Here’s a professional English overview of **Ceramic Dry Pressing** (also called **Dry Pressing** or **Uniaxial Pressing**), including its process, advantages, limitations, and applications:

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### **Ceramic Dry Pressing – Technical Overview**  

#### **1. Definition**  

**Dry pressing** is a powder compaction method where **granulated ceramic powder** is pressed in a rigid die under high **uniaxial pressure** (typically 10–100 MPa) to form a "green body" (unsintered compact). It is widely used for mass-producing simple-shaped ceramic parts.  

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### **2. Process Steps**  

1. **Powder Preparation**  

   - Ceramic powder (e.g., Al₂O₃, ZrO₂, SiC) is mixed with **1–5% organic binders** (e.g., PVA, PEG) to improve flowability and green strength.  

   - Granulation is done to ensure uniform particle packing.  

2. **Die Filling**  

   - Powder is fed into a **steel or carbide die cavity** (automated for high-volume production).  

3. **Compaction**  

   - A punch applies uniaxial pressure (single-action or double-action pressing).  

   - Typical pressure range: **10–100 MPa** (higher for advanced ceramics).  

4. **Ejection & Green Body**  

   - The pressed "green compact" is ejected and inspected for cracks/density variations.  

5. **Sintering**  

   - The green body is fired at high temperatures (1200–1700°C) to achieve densification.  

### **3. Advantages**  

✔ **High Production Speed** – Suitable for mass production (e.g., thousands of parts/day).  

✔ **Good Dimensional Control** – Tolerances of **±0.1–0.5%** achievable.  

✔ **Low Binder Content** – Reduces debinding time compared to injection molding.  

✔ **Cost-Effective** – Simple tooling and low energy consumption.  

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### **4. Limitations**  

❌ **Simple Shapes Only** – Difficult for complex geometries (undercuts, thin walls).  

❌ **Density Gradients** – Non-uniform pressure can cause layered density variations.  

❌ **Tooling Wear** – Abrasive powders (e.g., SiC) degrade dies over time.  

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### **5. Applications**  

- **Electronics**: Substrates, insulators, ceramic capacitors.  

- **Industrial**: Wear-resistant tiles, cutting tools, grinding media.  

- **Consumer Goods**: Sanitaryware, decorative tiles.  

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### **6. Key Parameters**  

| Parameter          | Typical Range               |  

|--------------------|-----------------------------|  

| Pressure           | 10–100 MPa                  |  

| Binder Content     | 1–5 wt%                     |  

| Green Density      | 50–60% of theoretical       |  

| Sintering Shrinkage| 15–20% linear               |  

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### **7. Comparison with Other Methods**  

| Method          | Shape Complexity | Production Rate | Density Uniformity |  

|-----------------|------------------|-----------------|--------------------|  

| **Dry Pressing** | Low–Medium       | Very High       | Moderate           |  

| **Isostatic Pressing** | High       | Low–Medium      | Excellent          |  

| **Injection Molding** | Very High | Medium          | Good               |  

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### **8. Industry Trends**  

- **Nanopowder Dry Pressing**: Enhanced sintering at lower temperatures.  

- **Automated Die Systems**: Robotics for higher precision and throughput.  

- **Binder-Free Pressing**: Reducing debinding steps for niche applications.